Materials R&D · To be agreed

Semiconductor Packaging Materials R&D — HBM / Underfill

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Category	Materials R&D
Location	Japan（To be agreed）
Employment	To be agreed
Salary	JPY 8,000,000–16,000,000 per year
Posted	Oct 23, 2026

Overview

Several urgent openings for advanced semiconductor packaging materials specialists.

Japan; specific worksite, employment arrangement and Japanese-language needs will be confirmed with the consultant. Start timing is flexible.

Responsibilities

Develop semiconductor back-end materials, including encapsulation/molding compounds or underfill.
Apply relevant HBM materials or injection-molding experience to packaging development.

Requirements

Preferred: at least 5 years developing encapsulation/molding compounds OR underfill materials.
Preferred: at least 3 years in HBM material development OR injection-molding-related work.
These are preferred experience profiles, not mandatory cumulative thresholds. Discuss your relevant experience with the consultant.
Preferred: Chinese and/or English communication skills.

Skills

EncapsulationMolding compoundsUnderfillHBMInjection molding

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